Machine learning is a mathematical construct that is the foundation for nearly all the advancements in AI. ML came first, but ...

Today, there are still many ways for defects to slip through final testing and get shipped to customers. However, in-line ...

Advanced packaging often relies on silicon interposers to connect chiplets and other components inside a package. The problem is that interposers typically exceed the reticle limit, which adds both ...

Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising?

After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, copper is no longer the best metallization choice. Yet it remains ...

A major challenge in 3D NAND design and manufacturing is tier bending and tier collapse (Figure 1b). Tier collapse of the ...

Fig. 1: Modeling qubits in a realistic way involves large-scale atomistic models with possibly amorphous materials, disorder, ...

A new technical paper titled “Ultra Ethernet’s Design Principles and Architectural Innovations” was published by researchers ...

A new technical paper titled “Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes ...

Narrowly defined verticals offer the best opportunities for AI. Plus, what will the impact be on junior engineers?

Time-of-flight sensors; manufacturing quantum chips; collaboration for growth; wafer shipment conundrum; sparse linear ...

A new technical paper titled “Architecting Long-Context LLM Acceleration with Packing-Prefetch Scheduler and Ultra-Large ...