China’s packaging sector is undergoing major environmental reform driven by regulation, innovation, and global supply chain demands.

Whether you’re looking for fresh ideas, new partners or a more complete view of where packaging is heading, London Packaging ...

While full alignment is unlikely, convergence in recyclability rules, EPR schemes and sustainability reporting is reducing ...

Amkor Technology's HDFO CPU packaging ramp and rising AI demand can nearly triple advanced packaging volumes in 2026 as compute growth accelerates.

In late April, thousands of creatives from around the world convened in Berlin for the iF Design Awards. The annual honors, ...

England’s Simpler Recycling rollout is driving operational changes across the packaging sector as firms adapt to stricter recycling rules and packaging waste requirements.

Each year, the iF DESIGN AWARD receives over 10,000 submissions spanning 93 categories of design. Participants include ...

As regulations take hold, SPC’s trends report highlights where packaging teams are focusing next, from harmonization to ...

Uniqode reports that dynamic QR Codes allow brands to update CPG packaging content seamlessly, reducing costs and improving ...

New photosensitive film combines proven technologies to enhance productivity and yield in semiconductor manufacturing ...

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates — areas it set aside after ...

Belgian food packaging specialist Galoppin Papier has invested in a Bobst Visioncut 106 LER Autoplaten die-cutter as the ...