AWS is also investing in the longer-term hardware path. In February 2025, Amazon announced Ocelot, a quantum computing chip developed by the AWS Center for Quantum Computing. Ocelot uses a ...

Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

Huawei's Tau Scaling Law targets 1.4nm chip density by 2031, challenging Nvidia's AI compute dominance globally.

Huawei has unveiled the Tau (τ) Scaling Law and a new LogicFolding chip architecture, aiming to build 1.4nm-class chips by ...

Huawei unveiled a full-stack data infrastructure solution for AI data centers at its IDI Forum 2026. The new architecture ...

At the 2026 International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai on Monday, He Tingbo, Huawei’s board member and head of its ...

Good workbench top materials include MDF with hardboard, plywood, butcher block, steel, and HDPE, depending on your project ...

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, today announced to showcase its vision of next-generation data center designs at Computex 2026 (Booth #J0106, TaiNEX1).

Japan’s Kioxia has set the mass production of its next-generation NAND flash memory as a top priority for next year — a move ...

Huawei unveiled 122TB enterprise SSDs using Die-on-Board packaging that boosts density 33%, working around US export controls ...

Huawei has bypassed tight US trade restrictions by creating a proprietary 122TB enterprise SSD for AI data centers. Blocked from purchasing advanced 100+ layer 3D NAND from suppliers like Samsung, ...

TL;DR: Huawei has developed a 122TB SSD using its Die-on-Board chip-packaging technology, enhancing capacity density despite lacking access to advanced 3D NAND. This wafer-level packaging improves ...