As many engineers know first-hand, the challenge isn’t just building machines that work, but building machines that can be ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

Explore how evolving tools shape architecture, from pen and ink to AI, transforming design and spatial understanding.

Nir Minerbi is a co-founder and the CEO of Classiq. He is highly experienced in leading groundbreaking, multi-national technological projects, from idea to deployment. Nir is a Talpiot alumnus and a ...