China’s packaging sector is undergoing major environmental reform driven by regulation, innovation, and global supply chain demands.

Whether you’re looking for fresh ideas, new partners or a more complete view of where packaging is heading, London Packaging ...

Amkor Technology's HDFO CPU packaging ramp and rising AI demand can nearly triple advanced packaging volumes in 2026 as compute growth accelerates.

In late April, thousands of creatives from around the world convened in Berlin for the iF Design Awards. The annual honors, ...

Each year, the iF DESIGN AWARD receives over 10,000 submissions spanning 93 categories of design. Participants include ...

Does anyone feel like a long holiday weekend slips away faster than you can plan for it? Traffic builds, campsites fill up, ...

India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is ...

New photosensitive film combines proven technologies to enhance productivity and yield in semiconductor manufacturing ...

Uniqode reports that dynamic QR Codes allow brands to update CPG packaging content seamlessly, reducing costs and improving ...

Condo, high-rise, and commercial moving support for Hollywood homes and businesses, backed by careful packing and ...

Belgian food packaging specialist Galoppin Papier has invested in a Bobst Visioncut 106 LER Autoplaten die-cutter as the ...

Formula 1 is desperately trying to fix its disastrous 2026 engine regulations. As we have extensively covered during the ...