Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet ...

Huawei unveiled a full-stack data infrastructure solution for artificial intelligence data centers (AI DCs) to accelerate construction and large-scale AI adoption for enterprises. Yuan Yuan, Vice ...

Huawei unveiled 122TB enterprise SSDs using Die-on-Board packaging that boosts density 33%, working around US export controls ...

Huawei's Tau Scaling Law targets 1.4nm chip density by 2031, challenging Nvidia's AI compute dominance globally.

AWS is also investing in the longer-term hardware path. In February 2025, Amazon announced Ocelot, a quantum computing chip developed by the AWS Center for Quantum Computing. Ocelot uses a ...

Japan’s Kioxia has set the mass production of its next-generation NAND flash memory as a top priority for next year — a move ...

Huawei has introduced a groundbreaking chip-making method based on the Tau Scaling Law, enabling 1.4 nm-equivalent transistor ...

Huawei has launched a new full-stack data infrastructure offering for AI data centers. Revealed during Huawei's Innovative Data Infrastructure Forum 2026, the launch includes the OceanStor Pacific ...

As AI computing density surges, traditional air cooling struggles to keep up with racks exceeding 100kW per cabinet, especially in hot and humid tropical environments. To address this, Midea Building ...

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, today announced to showcase its vision of next-generation data center designs at Computex 2026 (Booth #J0106, TaiNEX1).

South Korean chipmaker SK hynix has unveiled iHBM, a new thermal solution that embeds integrated cooling elements within high-bandwidth memory packages, targeting improved performance and reliability ...