Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

Wiwynn (6669), an innovative cloud IT infrastructure provider for data centers, today announced to showcase its vision of next-generation data center designs at Computex 2026 (Booth #J0106, TaiNEX1).

Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet ...

Huawei unveiled a full-stack data infrastructure solution for artificial intelligence data centers (AI DCs) to accelerate construction and large-scale AI adoption for enterprises. Yuan Yuan, Vice ...

This morning Huawei announced it will have a 1.4nm equivalent density process in place by 2031 – only three years behind TSMC – without using EUV. At the 2026 IEEE International Symposium on Circuits ...

Huawei's Tau Scaling Law targets 1.4nm chip density by 2031, challenging Nvidia's AI compute dominance globally.

AWS is also investing in the longer-term hardware path. In February 2025, Amazon announced Ocelot, a quantum computing chip developed by the AWS Center for Quantum Computing. Ocelot uses a ...

Huawei has introduced a groundbreaking chip-making method based on the Tau Scaling Law, enabling 1.4 nm-equivalent transistor ...

Huawei's Tau Scaling Law proposes replacing Moore's Law with time scaling and its LogicFolding architecture is already in production across 381 chips.

South Korean chipmaker SK hynix has unveiled iHBM, a new thermal solution that embeds integrated cooling elements within high-bandwidth memory packages, targeting improved performance and reliability ...

SK hynix Inc. (or "the company", announced today the launch of the iHBM solution that embeds integrated cooling ...

Open source robotics AI platform LeRobot surpassed 58,000 community datasets in 2026 — 50x growth in under a year — making it the largest dataset category on Hugging Face and signaling a ...