ASE Inc. is launching solder bumping technology for 300mm wafers. The Santa Clara, Calif., supplier of semiconductor packaging and testing services will bump, sort, saw, and die attach the wafers ...
A potential breakthrough technology from Nextreme (Research Triangle Park, NC)—a microscale thermal and power-management device manufacturer—integrates cooling and power-generation capabilities into ...
Co announces that Chipbond Technology, one of the world's largest merchant gold-bump foundries, has ordered Ultratech's Unity AP300 advanced-packaging lithography tool. Building on the successful ...
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