Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...

When temperatures increase, most materials tend to expand, causing a change in material dimensions. When two materials that exhibit different thermal expansion behaviors are in direct contact, such as ...

Although you are probably not aware of them, dozens of electronic control units (ECUs) — printed circuit boards (PCBs) in metal or plastic housings — exist in your car to control and monitor the ...

But only with the computer simulations from Vienna, it became possible to understand the details of this process so precisely that predictions for other materials could be made. "For the first time, a ...

All materials, with some exceptions, expand when they are heated. However, the amount of expansion per degree change in temperature varies depending on the substance. Since structures are made up of ...

In both residential and commercial buildings, heating and cooling cycles can take a toll on piping systems. When pipes expand due to heat and contract when they cool, they stress joints, supports, and ...