Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
Localized intelligence will reshape energy operations, enabling edge-based generative artificial intelligence (AI) models to deliver precision, agility, and control at every layer of power operations.
The process industry, characterized by continuous, large-scale production, is vital to modern manufacturing. In recent years, integrating big data and artificial intelligence (AI) into process ...
Marcus Hoversland, a UW graduate and process engineer at HF Sinclair in Casper, interacts with UW students in an “Intro to Chemical Engineering” class. UW has received a generous investment from HF ...
AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development. Chief ...
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