Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

As the heat density increases at the die level of more powerful semiconductor devices, there becomes a greater need for new and innovative cooling solutions. Standard Aluminum extrusions and bonded ...

The 040592 passive heat sink is designed for the Intel Pentium 4 family's Prescott 775 LGA microprocessor when used in 1U-high servers. The lightweight (300-g) aluminum device meets Intel's shock and ...

In recent years, increases in processing power mean advanced semiconductor devices now dissipate astounding levels of power. For many applications, cooling these devices has become a major challenge.

Increasing the processing power of electronic equipment often means that more transistors have to be squeezed into tighter packages. And higher circuit densities increase the amount of heat that must ...