Description: This product is a fast curing, one-part, conductive epoxy system primarily for die attach applications. It is not pre-mixed or frozen and has an unlimited working life at room temperature ...

Smaller PCBs, including rigid-flex circuits, call for die attach using one of three methodologies, depending on the application Technologies that for years were the sole domain of semiconductor ...

The 3HTND-2DA is a one-component, toughened, electrically insulating epoxy for die attaches applications. It has an exceptional electrical insulation properties and thermal conductivity, and very long ...

Venkat Nandivada, Manager of Technical Support at Master Bond Inc, talks to AZoM about die attach adhesives used in semiconductor assembly. Beyond their ability to form a tight bond between die and ...

Master Bond's advanced die-attach adhesives are increasingly accepted for the most demanding microelectronic semiconductor packaging as well as for chips-on-board assemblies. Both one component heat ...

SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), announced it has received a new order of its high-performance die attach ...