India's semiconductor strategy should broaden beyond fabrication to include design and equipment. Advanced packaging offers ...

Die attach or bonding, which is placing and attaching chips to substrates Hybrid bonding for copper-to-copper 3D chip stacking Molding Trimming Bonding is part of the assembly process, and assembly is ...

AI, 5G, IoT and consumer electronics are driving demand for automated laser scribing, precision vision, wafer-level packaging and smart manufacturing, especially in Asia-Pacific.Dublin, Sept. (GLOBE ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on Taiwan than ever. A silicon wafer reflecting Subramanian Iyer, a ...

In recent weeks and months, we have seen consumer memory prices going through the roof. The reason is that there is not enough capacity to fulfill demand for High Bandwidth Memory, which is memory ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

'Chip War' author Chris Miller advises India's Semicon 2.0 strategy to focus on chip design, equipment, and advanced ...

Shares in JCET Group continued to surge after China's largest semiconductor packaging and testing provider said it plans to invest more than $1 billion to boost its advanced chip-packaging capacity.

This photograph taken on September 10, 2025 shows engineers operating a wafer fabrication equipment used to process raw semiconductor wafers into finished chips at the OSAT (outsourced semiconductor ...